| 摘要 |
[Problem] To provide a conductive paste for laser etching, that can suppress the generation of short circuits and disconnections, even in the case of a complex pattern such as a long laser etching distance and a narrow laser etching width. [Solution] A conductive paste for laser etching containing (A) a binder resin made of thermoplastic resin and/or thermosetting resin, (B) a metal powder, and (C) an organic solvent, is characterized by a grind meter value between 0 and 20μm. Such a specific value enables to provide a conductive paste for laser etching, that can suppress the generation of short circuits and disconnections, even in the case of a complex pattern such as a long laser etching distance and a narrow laser etching width. |
