发明名称 |
FinFETs with Multiple Threshold Voltages |
摘要 |
A device includes a substrate, a semiconductor fin over the substrate, and a gate dielectric layer on a top surface and sidewalls of the semiconductor fin. A gate electrode is spaced apart from the semiconductor fin by the gate dielectric layer. The gate electrode includes a top portion over and aligned to the semiconductor fin, and a sidewall portion on a sidewall portion of the dielectric layer. The top portion of the gate electrode has a first work function, and the sidewall portion of the gate electrode has a second work function different from the first work function. |
申请公布号 |
US2017025312(A1) |
申请公布日期 |
2017.01.26 |
申请号 |
US201615284153 |
申请日期 |
2016.10.03 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Kuo Po-Chin;Lee Hsien-Ming |
分类号 |
H01L21/8234;H01L27/088;H01L29/49;H01L29/66;H01L29/16;H01L29/161;H01L29/165;H01L29/78;H01L21/28;H01L29/08 |
主分类号 |
H01L21/8234 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method comprising:
forming a gate dielectric on a semiconductor fin, wherein the gate dielectric comprises a top portion over a top surface of the semiconductor fin, and a sidewall portion on a sidewall of the semiconductor fin; forming a first metal layer over the gate dielectric, wherein the first metal layer comprises a first top portion overlapping the semiconductor fin, and a first sidewall portion on a sidewall of the sidewall portion of the gate dielectric; etching the first metal layer, wherein the sidewall portion of the first metal layer is removed; and depositing a second metal layer, wherein the second metal layer comprises a second top portion over the first top portion of the first metal layer, and a second sidewall portion extending on the sidewall portion of the gate dielectric, and wherein the first and the second metal layers comprise different materials. |
地址 |
Hsin-Chu TW |