| 摘要 |
PROBLEM TO BE SOLVED: To mass-produce a semiconductor module in which a semiconductor chip is sandwiched between a surface side conductive plate and a rear face side conductive plate and a resin is filled in a gap between the surface side conductive plate and the rear face side conductive plate, and a distance between the surface side conductive plate and the rear face side conductive plate is adjusted to be a predetermined distance.SOLUTION: In a semiconductor module manufacturing method, a plurality of projection pieces which project from one conductive plate of a surface side conductive plate and a rear face side conductive plate toward the other conductive plate by a predetermined distance is provided; a distance between the surface side conductive plate and the rear face side conductive plate is adjusted to be the predetermined distance by contacting the other conductive plate with the projection pieces. In the semiconductor module manufacturing method, a semiconductor chip and the conductive plate are solder bonded in a state where the distance is adjusted to be the predetermined distance, and subsequently, a molten resin is filled in a gap between the surface side conductive plate and the rear face side conductive plate. A flow phenomenon occurring at the time of filling the molten resin causes deformation of the projection pieces and the projection pieces and the other conductive plate are insulated from each other. |
