Thermosetting resin composition, method for producing same, method for producing cured resin product, and method for causing self-polymerization of epoxy compound

摘要

The present invention is directed to provide at least one of a novel thermosetting resin composition using an epoxy compound, a method for producing the composition, a method for producing a novel cured resin using an epoxy compound, and a novel method for causing self-polymerization of an epoxy compound. The thermosetting resin composition includes an epoxy compound, a gallium compound, and a silanol source compound. The method for producing the thermosetting resin composition includes a step of mixing the epoxy compound with the gallium compound and the silanol source compound. The method for producing a cured resin includes a step of heating an epoxy compound in the presence of a gallium compound and silanol. The method for causing self-polymerization of an epoxy compound is characterized by using a gallium compound and silanol as catalysts.

主权项

1. A thermosetting resin composition comprising an epoxy compound, a gallium compound, and a silanol source compound, wherein
said gallium compound. is gallium triacetylacetylacetonate or gallium acetate, and said silanol source compound comprises a monosilane compound and/or an organopolysiloxane of formula(19):
(R213SiO1/2)a2(R222SiO2/2)b2(R23SiO3/2)c2(SiO4/2)d2(O1/2H)e2   (19) where R21, R22, and R23 each independently represent a C1-10 hydrocarbon group, a2, b2, c2, and d2are each an integer of 0 or more and satisfy the condition of a2+b2+c2+d2≧3, and e2is a natural number of 1 or more and represents the number of a hydroxy group (s) directly bonded to a silicon atom.