Method of producing lightweight structural elements

摘要

The invention relates to a method of producing lightweight structural elements which are produced as a composition construction element having at least one cover plate and one carrier element which are connected to one another. A carrier element, at which at least one apertures and/or at least one cut-out is/are formed and at least one further element, which is a cover plate, are connected to one another. A carrier element and at least one cover plate can be formed from a glass, a glass ceramic material, a ceramic material and/or silicon having an oxide surface layer which is formed at least in the bonding region of the elements to be connected to one another. The carrier element should have at least a double thickness with respect to the thickness of a cover plate. The surfaces of the cover plate(s) and of the carrier element to be connected to one another should be intensely cleaned in their bonding regions and should be smoothed such that a roughness of the surface is achieved there, such that they are in direct touching contact with at least 80% of their bonding surface with an active compression source and in this respect a thermal treatment is carried out at a temperature of at least 100° C. and maintaining of the temperature over a period of at least 0.5 h to establish a bond connection of the cover plate(s) and the carrier element. In this respect, at least one cover plate should be connected to a surface of the carrier element at which at least one opening of an aperture or of a cut-out is arranged.

主权项

1. A method of producing lightweight structure elements as a composite component of at least two elements, wherein one element is a carrier element at which at least one aperture and/or at least one cut-out is/are formed, and at least one further element is a cover plate;
in this respect, a carrier element and at least one cover plate are used which are formed from a glass, a glass ceramic material, a ceramic material and/or silicon having an oxide surface layer which is formed at least in the bonding region of the elements to be connected to one another; and the carrier element has at least a double thickness with respect to the thickness of a cover plate; wherein the surfaces of the cover plate(s) and of the carrier element to be connected to one another in bonding regions are intensely cleaned and are smoothed such that a roughness of the surface is reached there, that they are in direct touching contact with at least 80% of their bonding surfaces with an active compression force on the elements to be bonded together in the range 2 kPa to 1500 kPa exerted using plunger stamp with an elastically deformable element inserted between the plunger or stamp and the elements to be bonded together; and in this respect a thermal treatment is carried out at a temperature of at least 100° C. and a maximum of 600° C. and a maintaining of the temperature over a period of at least 0.5 h to establish a bond connection of the cover plate(s) and the carrier element; wherein at least one cover plate is connected to a surface of the carrier element at which at least one opening of an aperture or of a cut-out is arranged.