发明名称 |
Fremgangsmåde til overføring af et anvendeligt lag |
摘要 |
Method for transferring a useful layer (3) onto a support (4), including the following main steps:
- formation of a fragilization plane (2) through the implantation of light species into a first substrate (1) in such a way as to form a useful layer (3) between this plane and a surface of the first substrate (1);
- application of the support (4) onto the surface of the first substrate (1) to form an assembly to be fractured (5) having two exposed sides (S1, S2);
- thermal fragilization treatment of the assembly to be fractured (5);
- initiation and self-sustained propagation of a fracture wave in the first substrate (1) along the fragilization plane (2). At least one of the sides (S1, S2) of the assembly to be fractured (5) is in close contact, over a contact zone, with an absorbent element (6a, 6b) suitable for capturing and dissipating acoustic vibrations emitted during the initiation and/or propagation of the fracture wave. |
申请公布号 |
DK2933828(T3) |
申请公布日期 |
2017.01.23 |
申请号 |
DK20150162329T |
申请日期 |
2015.04.02 |
申请人 |
Soitec;COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES |
发明人 |
Landru, Didier;KONONCHUK, Oleg;Ben Mohamed, Nadia;Massy, Damien;Mazen, Frédéric;RIEUTORD, François |
分类号 |
H01L21/762;H01L21/683 |
主分类号 |
H01L21/762 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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