发明名称 MOLDING SYSTEM AND METHOD FOR OPERATING THE SAME
摘要 A method for operating a molding machine includes specifying a simulating domain corresponding to a genuine domain in a mold disposed on the molding machine. The method proceeds to perform a virtual molding by using a setting packing pressure profile to generate a simulated state waveform, generating a designed state waveform including an isobaric phase and an isochoric phase while taking into consideration the simulated state waveform, and obtaining an updated packing pressure profile for applying a molding pressure to a portion of the genuine domain while taking into consideration a difference between the simulated state waveform and the designed state waveform. Subsequently, the method proceeds to set the molding machine while taking into consideration the updated packing pressure profile to perform an actual molding by applying an actual molding pressure to the at least a portion of the genuine domain to prepare the molding product.
申请公布号 US2017015040(A1) 申请公布日期 2017.01.19
申请号 US201615208416 申请日期 2016.07.12
申请人 CORETECH SYSTEM CO., LTD. 发明人 CHANG YUING;CHANG CHUAN WEI;CHANG RONG YEU;HSU CHIA HSIANG;CHIEN CHING CHANG;CHIU HSIEN SEN
分类号 B29C45/76;B29C45/78;G05B17/02;B29C45/77;G05B19/4097;G05B19/042 主分类号 B29C45/76
代理机构 代理人
主权项 1. A molding system, comprising: a molding machine; a mold disposed on the molding machine; and a computing apparatus connected to the molding machine, wherein the computing apparatus is programmed to perform operations for setting the molding machine, the operations comprising steps of: specifying a simulating domain corresponding to a genuine domain in the mold, wherein the genuine domain has a mold cavity to be filled with a molding resin from the molding machine to prepare a molding product;performing a virtual molding by using a setting packing pressure profile to generate a simulated state waveform expressing a relationship between an in-mold pressure and an in-mold temperature of the molding resin;generating a designed state waveform including an isobaric phase and an isochoric phase following the isobaric phase while taking into consideration the simulated state waveform;obtaining an updated packing pressure profile for applying a molding pressure to at least a portion of the genuine domain while taking into consideration a difference between the simulated state waveform and the designed state waveform; andsetting the molding machine while taking into consideration the updated packing pressure profile to perform an actual molding by applying an actual molding pressure to the at least a portion of the genuine domain to prepare the molding product.
地址 HSINCHU COUNTY TW