发明名称 |
PHOSPHONIUM COMPOUND, EPOXY RESIN COMPOSITION INCLUDING THE SAME AND SEMICONDUCTOR DEVICE PREPARED USING THE SAME |
摘要 |
A phosphonium compound, an epoxy resin composition including the same, a semiconductor device encapsulated with the same, and a method of encapsulating a semiconductor device, the phosphonium compound being represented by Formula 1:; |
申请公布号 |
US2017018473(A1) |
申请公布日期 |
2017.01.19 |
申请号 |
US201615209871 |
申请日期 |
2016.07.14 |
申请人 |
SAMSUNG SDI CO., LTD. |
发明人 |
KWON Ki Hyeok;KIM Min Gyum;CHUNG Joo Young;CHEON Jin Min;CHOI Jin Woo;HAN Seung;LEE Dong Hwan |
分类号 |
H01L23/29;C07F7/04;C09J163/00;C08K3/36;C08K3/04;C08L63/00;H01L21/56;C07F9/54 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
1. A phosphonium compound represented by Formula 1: wherein, in Formula 1, R1, R2, R3, and R4 are each independently a substituted or unsubstituted C1 to C30 aliphatic hydrocarbon group, a substituted or unsubstituted C6 to C30 aromatic hydrocarbon group, or a substituted or unsubstituted C1 to C30 hydrocarbon group having a hetero atom; R5, R6, and R7 are each independently hydrogen, a substituted or unsubstituted C1 to C30 aliphatic hydrocarbon group, a substituted or unsubstituted C6 to C30 aromatic hydrocarbon group, or a substituted or unsubstituted C1 to C30 hydrocarbon group having a hetero atom; and M is an alkali metal. |
地址 |
Yongin-si KR |