发明名称 PHOSPHONIUM COMPOUND, EPOXY RESIN COMPOSITION INCLUDING THE SAME AND SEMICONDUCTOR DEVICE PREPARED USING THE SAME
摘要 A phosphonium compound, an epoxy resin composition including the same, a semiconductor device encapsulated with the same, and a method of encapsulating a semiconductor device, the phosphonium compound being represented by Formula 1:;
申请公布号 US2017018473(A1) 申请公布日期 2017.01.19
申请号 US201615209871 申请日期 2016.07.14
申请人 SAMSUNG SDI CO., LTD. 发明人 KWON Ki Hyeok;KIM Min Gyum;CHUNG Joo Young;CHEON Jin Min;CHOI Jin Woo;HAN Seung;LEE Dong Hwan
分类号 H01L23/29;C07F7/04;C09J163/00;C08K3/36;C08K3/04;C08L63/00;H01L21/56;C07F9/54 主分类号 H01L23/29
代理机构 代理人
主权项 1. A phosphonium compound represented by Formula 1: wherein, in Formula 1, R1, R2, R3, and R4 are each independently a substituted or unsubstituted C1 to C30 aliphatic hydrocarbon group, a substituted or unsubstituted C6 to C30 aromatic hydrocarbon group, or a substituted or unsubstituted C1 to C30 hydrocarbon group having a hetero atom; R5, R6, and R7 are each independently hydrogen, a substituted or unsubstituted C1 to C30 aliphatic hydrocarbon group, a substituted or unsubstituted C6 to C30 aromatic hydrocarbon group, or a substituted or unsubstituted C1 to C30 hydrocarbon group having a hetero atom; and M is an alkali metal.
地址 Yongin-si KR