| 摘要 |
PROBLEM TO BE SOLVED: To provide a container for hollow package exhibiting excellent heat dissipation of heat generated by a solid image sensor.SOLUTION: A container for hollow package comprises: a resin container 1 having a recess 1a in which a solid state image sensor is mounted; a lead 2 having an inner lead 2a exposed in the recess 1a, and an outer lead 2b exposed to the outside of the container 1; and an island 3 having an island body 3a placed in the bottom of the recess 1a. The island 3 also has surface side heat dissipation parts 3b, 3c, 3d exposed to the surface of protrusions 1b1, 1b2, 1b5 formed on the frame 1b surrounding the recess 1a. The island 3 also has a bottom side heat dissipation part 3e protruding laterally of the container 1. |
