发明名称 |
SUBASSEMBLY THAT INCLUDES A POWER SEMICONDUCTOR DIE AND A HEAT SINK HAVING AN EXPOSED SURFACE PORTION THEREOF |
摘要 |
The semiconductor assembly includes a first subassembly having a heat sink. Solder material is disposed on the exposed portion of a first surface of heat sink. A power semiconductor die is located on the first surface of the heat sink and is thermally coupled thereto by the solder material. A packaging patterned polymer layer is disposed on a second surface of the heat sink opposing the first surface and defines an interior surface portion of the heat sink. A semiconductor package is provided in which the first subassembly, solder material and die are located such that the interior surface portion of the second surface of the heat sink is not enclosed by the semiconductor package. |
申请公布号 |
EP2168154(B1) |
申请公布日期 |
2017.01.18 |
申请号 |
EP20080781550 |
申请日期 |
2008.07.09 |
申请人 |
Vishay General Semiconductor LLC |
发明人 |
CHIANG, Wan-Lan;LIN, Kuang, Hann;PENG, Chih-Ping |
分类号 |
H01L23/367;H01L23/40;H01L23/433;H01L23/495 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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