| 摘要 |
PROBLEM TO BE SOLVED: To provide a diode package having an improved lead wire, and a manufacturing method therefor.SOLUTION: In the diode package, an upper lead wire 130 and a lower lead wire 140, having long planar shapes, respectively include mutually opposite first stages and second stages. The lower face of the first stage of the upper lead wire 130 is adhered to the top face of a diode chip 110, and the top face of the first stage of the lower lead wire 140 is adhered to the lower face of the diode chip 110. Further, the second stage of the upper lead wire 130 and the second stage of the lower lead wire 140 are extracted to the outside in the side direction of a molding compound 120. Preferably the first stage of the upper lead wire 130 includes a formed hemispherical contact ball 132 that recesses downward from the top in a hemispherical shape and protrudes downward in a hemispherical shape. In this case, a through hole 133 is formed at the center of the hemispherical contact ball 132. |
