发明名称 半導体装置
摘要 A semiconductor device includes a channel layer; and a high resistance layer that is provided on the channel layer, and is made of a semiconductor with high resistance which has a conduction band position higher than that of the semiconductor which forms the channel layer. The semiconductor device includes a first conduction-type low resistance region provided on a surface layer of the high resistance layer, and is made of a semiconductor including first conduction type impurities. The semiconductor device includes: a source electrode and a drain electrode that are connected to the high resistance layer, in a position crossing the low resistance region; a gate insulating film provided on the low resistance region; and a gate electrode provided on the low resistance region via the gate insulating film. The semiconductor device includes current block regions between the low resistance region, and between the source electrode and the drain electrode respectively.
申请公布号 JP6056435(B2) 申请公布日期 2017.01.11
申请号 JP20120268315 申请日期 2012.12.07
申请人 ソニー株式会社 发明人 谷口 理;竹内 克彦
分类号 H01L21/338;H01L21/336;H01L29/41;H01L29/423;H01L29/49;H01L29/778;H01L29/78;H01L29/812 主分类号 H01L21/338
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