| 摘要 |
PROBLEM TO BE SOLVED: To inhibit an influence on a bonding part of an electrode of a semiconductor chip and a surface wiring layer of a module substrate caused by temperature variation at the time of mounting or at the time of operation in a semiconductor module having a structure in which the semiconductor chip is sandwiched by a pair of module substrates.SOLUTION: A semiconductor module 1 according to the present embodiment comprises: a semiconductor chip 10 having electrodes on both electrode surfaces, respectively; and a pair of module substrates 11, 12 which are arranged on respective electrode surfaces of the semiconductor chip 10 and includes surface wiring layers 52, 62 having electrodes. The electrodes on each electrode surface of the semiconductor chip 10 are bonded to the electrodes of each opposite surface wiring layer of the module substrate. An electrode 50 in a surface wiring layer 52 of the module substrate 11 includes a groove 55. The semiconductor module further comprises rear face wiring layers 70, 71 on respective substrate rear faces of the module substrates 11, 12, respectively. |
