| 摘要 |
PROBLEM TO BE SOLVED: To perform plasma processing effectively for a warped substrate or a substrate having a protrusion on the back.SOLUTION: A plasma processing apparatus 100 performing plasma processing for a substrate 200 includes a housing 101 having a base 111 and a lid 112, an electrode body 102 arranged on the back of a processed substrate 200, a rail 103 arranged between the electrode body 102 and lid 112 so as to traverse the electrode body 102, and forming a conveyance path of the substrate 200 and holding the substrate 200 under plasma processing, a regulation member 106 having a flange-like regulation part 163 for regulating the floating of the rail 103 during conveyance or plasma processing of the substrate 200, and being attached to the base 111, and a plasma generation power supply 104 for generating plasma in the housing 101. |
