发明名称 電子デバイスの製造装置
摘要 The electronic device manufacturing apparatus is provided with: a substrate holding member; a first supply source which is provided so as to move relative to the primary surface side of the substrate, and which forms a nitrogen-containing layer by supplying a nitrogen-containing compound towards the primary surface of the substrate; and a second supply source which is disposed downstream of the first supply source in the direction of movement relative to the substrate, which forms a transparent electrode layer by supplying towards the primary surface of the substrate an electrode material having silver as the main component thereof, and which is disposed such that, between starting formation and two minutes after finishing formation of the nitrogen-containing layer at a prescribed position on the substrate, formation of the transparent electrode layer is started at said prescribed position on the substrate.
申请公布号 JP6028794(B2) 申请公布日期 2016.11.16
申请号 JP20140512714 申请日期 2013.04.26
申请人 コニカミノルタ株式会社 发明人 木下 敏幸;波木井 健;石代 宏;吉田 和央;小野 美奈子;辻村 隆俊
分类号 H05B33/10;H01L51/50;H05B33/28 主分类号 H05B33/10
代理机构 代理人
主权项
地址