发明名称 |
ELECTRONIC CIRCUIT DEVICE |
摘要 |
To improve the heat dissipating effect of a conductor layer while suppressing a crack of a substrate along an interface between an insulating layer and a conductor layer. An electronic circuit device (100) has an insulating layer (10), a conductor layer (2) provided on at least one face side of the insulating layer (10), and a heat generating element (4) provided on a face of the conductor layer (2) at a side opposite of the insulating layer (10) via a joining layer (3). The conductor layer (2) has a heat dissipating conductor layer (21) located on a heat generating element (4) side and a circuit layer (22) located on an insulating layer (10) side, and the shortest distance (l 1 ) between a side end portion of the heat generating element (4) and a side end portion of the heat dissipating conductor layer (21) on a face of the heat dissipating conductor layer (21) on the circuit layer (22) side is greater than or equal to a thickness (t 1 ) of the heat dissipating conductor layer (21). |
申请公布号 |
EP3093882(A1) |
申请公布日期 |
2016.11.16 |
申请号 |
EP20140877890 |
申请日期 |
2014.12.15 |
申请人 |
FURUKAWA ELECTRIC CO. LTD. |
发明人 |
KOJIMA NAOYUKI;SATO SHUNICHIRO;HIKASA KAZUHITO;FUJIWARA HIDEMICHI |
分类号 |
H01L23/12;H01L23/36;H05K1/02 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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