| 摘要 |
PROBLEM TO BE SOLVED: To provide a defect inspection apparatus capable of detecting only a defect on the wafer surface, without being influence by the surface state of an inspection stage, even for a wafer transmitting light.SOLUTION: An inspection apparatus of semiconductor wafer includes an inspection stage, and a wafer mounting jig to be mounted on the inspection stage. The wafer mounting jig has a hollow cylinder as the body, and has a counterbore provided along the inner periphery, on the upper surface side, i.e., the side opposite to the side in contact with the inspection stage, in the sidewall of the cylinder. The counterbore is formed while having a diameter larger than that of a semiconductor wafer becoming an inspection object. When mounting the semiconductor wafer on the bottom face of the counterbore so as to come into contact with the reverse face of the semiconductor wafer, the semiconductor wafer is held while keeping a constant distance between the inspection stage. The constant distance is determined based on the amount of the semiconductor wafer inspection light, reflected on the inspection stage surface.SELECTED DRAWING: Figure 1 |
