发明名称 中空封止構造及びそれを備えた中空パッケージ
摘要 PROBLEM TO BE SOLVED: To prevent the deterioration of the airtightness of a hollow part due to changes of an environmental temperature.SOLUTION: When a cap including a hollow part is sealed to a substrate by a coating resin, a protrusion having a portion, which is larger than the root side, on at least the tip side, is provided at an outer peripheral end part of the cap. The cap and the substrate are placed in close contact with each other while the coating resin is enclosing the protrusion to put the hollow part in the sealing state.
申请公布号 JP6007535(B2) 申请公布日期 2016.10.12
申请号 JP20120066080 申请日期 2012.03.22
申请人 日本電気株式会社 发明人 田子 雅基
分类号 H01L23/02;H03H9/02;H03H9/25 主分类号 H01L23/02
代理机构 代理人
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