| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface protection sheet which has an annular adhesive layer on a periphery portion of one surface of a support medium, and prevents a wafer from coming off by coping with a shear force generated in grinding a rear face of a semiconductor wafer.SOLUTION: A surface protection sheet 10 is a surface protection sheet used in grinding a rear face of a semiconductor wafer, includes an annular adhesive layer 2 on a periphery portion of one surface of a support medium 1. A probe tack value on an inner circumferential portion of the support medium 1 is 5-600 mN/5 mmΦ. The support medium is composed of polyurethane acrylate. |
