| 摘要 |
The invention provides a processing method. Chippings of an adhesion sheet can be prevented from adhering on the surface of a plate-shaped object completely when cutting and expanding a plate-shape object such as a wafer with the adhesion sheet bonded on the back face. The wafer (1) equipped with a protection component (11) on the surface (1a) and cut into chips along predetermined lines is arranged on an expanding strip (13), then a protruding part (12a) of the adhesion sheet (12) protruding from the outer peripheral side of the wafer (1) is split (a first expanding step). Then the protection component (11) is removed (a protection component removing step). The expanding strip (13) is expanded further along the chips (3) for cutting the adhesion sheet (12), so that a plurality of chips (3) with the adhesion sheets (12) are obtained (a second expanding step). Chippings of the adhesion sheets produced in splitting the adhesion sheets are adhered on the protection component, so that the chippings are prevented from adhering on the surface of the wafer. |
