发明名称 |
COMPOSITE SOLDER BALL, SEMICONDUCTOR PACKAGE USING THE SAME, SEMICONDUCTOR DEVICE USING THE SAME AND MANUFACTURING METHOD THEREOF |
摘要 |
A semiconductor package includes a first substrate, a second substrate, a composite solder ball and a first semiconductor component. The composite solder ball includes a core, an encapsulating layer and a barrier layer. The composite solder ball is disposed between the first substrate and the second substrate for electrically connecting the first substrate and the second substrate. The barrier layer is disposed between the core and the encapsulating layer. Wherein a melting point of the barrier layer is higher than a melting point of the core, the melting point of the core is higher than a melting point of the encapsulating layer. The first semiconductor component is disposed between the first substrate and the second substrate. |
申请公布号 |
EP3067924(A1) |
申请公布日期 |
2016.09.14 |
申请号 |
EP20150193187 |
申请日期 |
2015.11.05 |
申请人 |
MEDIATEK, INC |
发明人 |
CHENG, TAO;HSU, WEN-SUNG;LIN, SHIH-CHIN |
分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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