| 摘要 |
The present invention relates to a substrate treating apparatus, a cluster equipment for treating a substrate, and an operating method of a substrate treating apparatus. According to an embodiment of the present invention, the substrate treating apparatus may comprise: a plurality of accommodating units to accommodate a substrate holder in which a substrate is mounted; a plurality of treating units to treat the substrate; a conveying unit to convey the substrate between the substrate holder, which is accommodated in the accommodating units, and the treating units; and a control unit to control the operation of the substrate treating apparatus to perform a process of treating the substrate and to, when the substrate holders are all accommodated in the plurality of accommodating units and one or more of the plurality of treating units are idling, select a target accommodating unit among the plurality of accommodating units, to take out a first substrate holder from the target accommodating unit, to put in a second substrate holder in the target accommodating unit, to convey the substrate mounted in the second substrate holder to an idling substrate treating unit, and to control the idling substrate treating unit to treat the substrate. The present invention aims to provide a substrate treating apparatus, a cluster equipment for treating a substrate, and an operation method thereof, which do not leave a process handling module idling even when all load ports are occupied with FOUP and which let all process handling modules operate. |
