| 摘要 |
Maintenance of a flow tank is facilitated. A sub-module 12 is provided adjacent to a main module 10. A board is introduced in the sub-module 12, and is heated by a heater 352 that is at a heating position, is moved to the main module 10, solder is applied by a flow tank 206 in parallel with insertion of a component by a component insertion device 22, and thereby the component is mounted. If a maintenance condition is established, introduction of boards is stopped, the heater 352 is moved to a standby position, and the flow tank 206 is moved to a maintenance position of the sub-module 12. Maintenance is performed on the flow tank 206 and since the component insertion device 22 is not present above the flow tank 206, it is possible to facilitate inspection, removal, and the like of the flow tank 206. |
