发明名称 |
COPPER-CLAD LAMINATE AND METHOD FOR MANUFACTURING SAME |
摘要 |
Provided is a copper-clad laminate comprising a metal conductor layer formed by dry plating and/or wet plating on a surface obtained by subjecting a surface of a liquid crystal polymer film to plasma treatment in an oxygen atmosphere or a nitrogen atmosphere at a gas pressure of 2.6 to 15 Pa. Further provided is a copper-clad laminate comprising a liquid crystal polymer film having a surface roughness after the plasma treatment of 0.15 µm or less in terms of arithmetic mean roughness Ra and 0.20 µm or less in terms of root-mean-square roughness Rq. Further provided is a method for manufacturing a copper-clad laminate, wherein a metal conductor layer is formed by dry plating and/or wet plating after subjecting a surface of a liquid crystal polymer film to plasma treatment in an oxygen atmosphere or a nitrogen atmosphere at a gas pressure of 2.6 to 15 Pa. |
申请公布号 |
EP2662208(A4) |
申请公布日期 |
2016.08.31 |
申请号 |
EP20110854715 |
申请日期 |
2011.12.26 |
申请人 |
JX NIPPON MINING & METALS CORPORATION |
发明人 |
SAKAGUCHI KAZUHIKO;INAZUMI HAJIME;YACHI HISAKAZU |
分类号 |
B32B15/09;C08J7/00;C08J7/12 |
主分类号 |
B32B15/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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