| 摘要 |
The present invention provides a protective tape peeling method and a protective tape peeling device. In the protective tape peeling method, a peeling rod swings in the way of being consistent with incline of a peeling tape towards a width direction of a tape pasting surface, while the tape pasting surface is maintained to be parallel to a top end of the peeling rod, the peeling tape is pasted on the protective tape which is pasted on a surface of a semiconductor wafer, and the peeling tape is peeled in a fold-back way by utilizing the peeling rod. Along with the peeling motion from the peeling rod to the peeling tape, the protective tape and the peeling tape are integrally peeled from the surface of the semiconductor wafer, and the peeling tape along with the protective tape is reeled up on a reeling shaft with a receiving part. |
