发明名称 配線基板
摘要 PROBLEM TO BE SOLVED: To provide a wiring board which has high strength in a connection between a connection part of the wiring board and an electronic component or an external circuit board.SOLUTION: In a wiring board 10, a connection part 1A is provided on a main surface of an insulation substrate 1. The connection part 1A includes: a first metal layer 2 that is provided on the main surface of the insulation substrate 1; a first insulation coat layer 4 coating an outer peripheral part of the first metal layer 2; a second metal layer 3 adhering to an area ranging from a center part of the first metal layer 2 to a surface of the first insulation coat layer 4; and a second insulation coat layer 5 coating an outer peripheral part of the second metal layer 3. The first and second metal layers 2, 3 and the first and second insulation coat layers 4, 5 are securely bonded to each other and heat stress is dispersed. These features inhibit mechanical destruction in the connection part 1A etc.
申请公布号 JP5977180(B2) 申请公布日期 2016.08.24
申请号 JP20130009427 申请日期 2013.01.22
申请人 京セラ株式会社 发明人 松尾 一博;平川 哲生
分类号 H05K3/34;H01L23/12;H01L23/13;H05K3/46 主分类号 H05K3/34
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