METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP

摘要

The purpose of the present invention is to provide a method for dicing a wafer in a state of being reinforced by a dicing tape and manufacturing a semiconductor chip, wherein positional displacement and similar problems are prevented from occurring even when an aqueous organic solvent is used, and adhesion of residues on the resulting semiconductor chip is prevented from occurring. The present invention is a method for manufacturing a semiconductor chip, the method having at least: a dicing tape affixing step for affixing a dicing tape, which comprises a substrate film and an adhesive layer containing a curable adhesive component which is crosslinked and cured by a stimulus, onto a wafer from the adhesive layer side to reinforce the wafer; an adhesive layer curing step for applying a stimulus to the adhesive layer and crosslinking and curing the curable adhesive component; a dicing step for dicing the wafer reinforced by the dicing tape and obtaining a semiconductor chip; and a semiconductor chip peeling step for peeling the semiconductor chip from the dicing tape.