| 摘要 |
A pre-processing structure, a manufacturing method and a pre-processing method for a flexible circuit board covering film. The pre-processing structure for a flexible circuit board covering film comprises a plurality of covering films (A). Each covering film sequentially comprises a basic layer (1), a bonding layer (2) and a release layer (3) from top to bottom. The plurality of covering films is laminated, and the release layer of the upper covering film is bonded to or electrostatic adsorbed with the basic layer of the lower covering film. When in pre-processing, a covering film composite body is clamped between a cover plate and a liner plate to perform be drilling processing; the covering film composite body is punched; after the machining, the covering films are separated. The pre-processing method improves the production rate of the pre-processing of the flexible circuit board covering film, reduces the consumption of auxiliary materials, and reduces production costs of the flexible circuit board. |
