| 摘要 |
Provided are an interposer substrate laminate that is obtained by providing, on an interposer substrate having a plurality of through holes, a separate substrate, with a metal layer therebetween, and that has excellent heat dissipation properties, and a manufacturing method for the same. Specifically, this manufacturing method for an interposer substrate laminate comprises at least a pressurization step for causing a surface of an interposer substrate and a surface of a separate substrate to face each other and applying a pressure of 5 kgf/cm2 or more to bond the surfaces together. The interposer substrate comprises: a plurality of through holes or grooves; and a conductive material that is filled in the through holes or grooves and projects to a height that is greater than 0 μm and not more than 10 μm from the surface to be bonded having the through holes or grooves. On the surface of the separate substrate, a metal layer is formed. The conductive material is formed of a metal material and a carbon material. Further, this interposer substrate laminate is provided with an interposer substrate, a metal layer provided on a surface of the interposer substrate to be bonded, and a separate substrate provided on the metal layer. |
