| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a heater cleaning method which enable a heater to be cleaned well.SOLUTION: A substrate processing apparatus 1 includes: a heater head 35 having an infrared ray lamp 38 and a lamp housing 40; a heater arm 34 holding the heater head 35; and a swing driving mechanism 36 swinging the heater arm 34 in a horizontal direction. When the SPM liquid film heating process is carried out, the heater head 35 is disposed so as to face a surface of the wafer W and heats the surface of the wafer W. The substrate processing apparatus 1 includes a cleaning pod 80. The cleaning pod 80 is disposed at a home position of the heater head 35, and a lower surface 52B of the heater head 35 is immersed in a cleaning fluid accumulated in the cleaning pod 80. |
