发明名称 超音波プローブおよび超音波プローブの製造方法
摘要 A backing material is provided on the back face side of a piezoelectric transducer, with a first width substantially equal to the piezoelectric transducer widthwise and perpendicular to the radiation direction. A front face of a layer located on the front face side with regard to a wiring pattern has a width substantially equal to the first width. Moreover, the back face of this layer has a second width shorter than the first width. A space is provided between this layer and the backing material due to the difference between the first width and the second width of this layer, and a covering member covering the wiring pattern covers the wiring pattern extending at least from the folded section of the flexible substrate into the space.
申请公布号 JP5954773(B2) 申请公布日期 2016.07.20
申请号 JP20120055236 申请日期 2012.03.13
申请人 東芝メディカルシステムズ株式会社 发明人 岡田 健吾;四方 浩之;青木 稔;手塚 智;牧田 裕久
分类号 H04R17/00;H04R31/00 主分类号 H04R17/00
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