| 摘要 |
A semiconductor device including a first semiconductor chip and a second semiconductor chip which are bump bonded to each other with a clearance therebetween sealed with resin injected from a prescribed position on the first semiconductor chip in a manner that a space between bumps formed by bump bonding is filled with the resin, and a plurality of concave and convex sections which are formed on a surface side of the first semiconductor chip, the surface being bonded with the second semiconductor chip, and have a protruding section which straddles at least one convex section out of convex sections of the plurality of concave and convex sections formed in a surrounding section of a bonding region between the first semiconductor chip and the second semiconductor chip. |
