| 摘要 |
PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive sheet used, on back surface processing of a semiconductor wafer, as a surface-protecting sheet for protecting the surface of the semiconductor wafer, where the pressure-sensitive adhesive sheet has an intermediate layer that absorbs or moderates the level difference on the surface of a bump wafer or the like and does not excessively soften under a high-temperature environment.SOLUTION: The pressure-sensitive adhesive sheet comprises a substrate film, an intermediate layer and a pressure-sensitive adhesive layer laminated in this order, where the intermediate layer comprises a hot-melt resin having a melting point (Tm), and the storage elastic modulus G' (Tm+6) of the intermediate layer at a temperature (Tm+6) 6°C higher than the melting point Tm and the storage elastic modulus G' (Tm-6) of the intermediate layer at a temperature (Tm-6) 6°C lower than the melting point Tm satisfy the relationship of G'(Tm-6)/G'(Tm+6)≥2.0. |
