| 摘要 |
The mobile bridge 2 apparatus comprises a number of bridge modules 6, 4 and a number of sensors 10 for sensing a deformation of the one or more mobile modules. There may be several modules each with a sensor or sensors located in different places. The bridge modules may include ramps and inter ramp modules. The sensors may be arranged to transmit deformation information. The deformation information may include timing information. The sensor may be bonded as part of a non destructive reinforcement of the module. The sensor may be battery powered. |
