POSITIVE TYPE PHOTOSENSITIVE POLYAMIDE RESIN, THE COMPOSITE OF THE SAME AND MANUFACTURING METHOD THEREOF

摘要

The present invention relates to a positive-type photosensitive polyamide resin and a composition used to manufacture the same. More specifically, the present invention relates to positive-type photosensitive polyamide and a composition thereof having effects of reducing manufacturing costs and simplifying the manufacturing process as the positive-type photosensitive polyamide exhibits excellent solubility to alkaline solvents such as a tetra-ammonium hydroxide aqueous solution and needs not to use a solution like N-methylpyridinium (NMP).