EPOXY RESIN COMPOSITION FOR ELECTRONIC MATERIAL, CURED OBJECT OBTAINED THEREFROM, AND ELECTRONIC MEMBER

摘要

Provided are: an epoxy resin composition for electronic materials which exhibits excellent heat resistance, low thermal expansibility, and high thermal conductivity and further has a low melting point and low-melt-viscosity characteristics; and a cured object obtained from the epoxy resin composition. Also provided is an electronic member including the cured epoxy resin object. The epoxy resin composition includes an epoxy resin which is a polyglycidyloxy-p-terphenyl compound having three or more glycidyl groups. The epoxy resin composition has a low melting point and a low viscosity, shows high thermal conductivity attributable to the terphenyl skeleton, and shows excellent heat resistance and high-temperature-region low thermal expansibility which are attributable to the polyfunctional design.