PACKAGE APPARATUS AND MANUFACTURING METHOD THEREOF

摘要

A package apparatus comprises a first conductive wiring layer, a first conductive pillar layer, a first conductive glue layer, an internal component, a second conductive pillar layer, a first molding compound layer and a second conductive wiring layer. The first conductive pillar layer is disposed on the first conductive wiring layer. The first conductive glue layer is disposed on the first conductive wiring layer. The internal component has a first electrode layer and a second electrode layer, wherein the first electrode layer is disposed and electrical connected to the first conductive glue layer. The second conductive pillar layer is disposed on the second electrode layer. Wherein the first conductive wiring layer, the first conductive pillar layer, the first conductive glue layer, the internal component and the second conductive pillar layer are disposed inside the first molding compound layer.

主权项

1. A package apparatus, comprising:
a first conductive wiring layer; a first conductive pillar layer, disposed on the first conductive wiring layer; a first conductive glue layer, disposed on the first conductive wiring layer; an internal component, formed with a first electrode layer and a second electrode layer in a manner that the first electrode layer is disposed and electrically connected to the first conductive glue layer; a second conductive pillar layer, disposed on the second electrode layer of the internal component; a first dielectric material layer; and a second conductive wiring layer, disposed on the first conductive pillar layer, the second conductive pillar layer and the first dielectric material layer; wherein, the first conductive wiring layer, the first conductive pillar layer, the first conductive glue layer, the internal component and the second conductive pillar layer are disposed inside the first dielectric material layer.