发明名称 |
WAFER GROUP, WAFER MANUFACTURING DEVICE, AND WAFER MANUFACTURING METHOD |
摘要 |
The present invention addresses the problem of providing a wafer group which can easily secure uniformity of products manufactured by the wafer group in which the composition varies among the wafers. The present invention further addresses the problem of providing a technology that excludes uncertain elements in forming an orientation flat and forms the orientation flat with extremely high probability and extremely high precision. Provided is a wafer group and a technology relating to the wafer group that comprises a plurality of wafers which are obtained from an identical ingot, and all of which have orientation flats, wherein the plurality of wafers comprise 70 or more of wafers, and the orientation accuracy of the orientation flat in each of the wafers is ±0.010° or lower. |
申请公布号 |
WO2016098662(A1) |
申请公布日期 |
2016.06.23 |
申请号 |
WO2015JP84529 |
申请日期 |
2015.12.09 |
申请人 |
DOWA ELECTRONICS MATERIALS CO., LTD. |
发明人 |
SHOJI SHINYA;ISHII MAKOTO;UMETSU KAZUYUKI;SUGIURA JUNJI |
分类号 |
H01L21/304;B28D5/00 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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地址 |
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