Portable, Liquid Free, Electroless, Electrochemical Deposition of Metal on Conductive and Nonconductive Surfaces

摘要

Electroless plating is accomplished by forming a metal salt and a polymer solution as a binder into a solid electrolyte block and depositing metal on the surface by rubbing or brushing the solid electrolyte block onto a surface with minimal or no water and without an electric potential/power source. The solid electrolyte block is also conformable/moldable and can be used to deposit metal on to both conductive and nonconductive surface through electroless deposition process.

主权项

1. Apparatus comprising a metal electrolyte assembly adapted for selectively depositing metal on a surface, the metal electrode assembly further comprising a solid electrolyte block having a metal salt and a polymer solution acting as a binder, wherein the solid electrolyte block is adapted for rubbing on a surface on which metal from the metal salt is to be deposited.