发明名称 |
Vibration module for sound transducer |
摘要 |
The present invention relates to a vibration module for a sound transducer and, more particularly, to a vibration module for a sound transducer which can prevent sound leakage by minimizing contacts between a diaphragm and a voice coil. The vibration module for the sound transducer according to the present invention comprises: a substrate having an inner portion and an outer portion, an electrical connection portion for applying electrical signals to a voice coil being provided on the inner portion and a terminal being provided on the outer portion, for performing electrical connection between the electrical connection portion and the terminal; a first diaphragm attached between the inner portion and outer portion of the substrate; and the voice coil mounted on the inside of the inner portion of the substrate with a certain distance from the first diaphragm and electrically connected to the electrical connection portion. |
申请公布号 |
EP2725820(B1) |
申请公布日期 |
2016.06.22 |
申请号 |
EP20130004484 |
申请日期 |
2013.09.13 |
申请人 |
EM-TECH. CO., LTD. |
发明人 |
CHOI, KYU DONG;PARK, KIL DONG;JEONG, IN HO;KWON, JOONG HAK |
分类号 |
H04R7/14;H04R9/04;H04R31/00 |
主分类号 |
H04R7/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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