METHOD FOR MANUFACTURING COPPER-SILVER ALLOY FOR ELECTRICAL CONTACT MATERIAL BY USING DIFFUSION BONDING

摘要

Provided is a method of manufacturing a copper (Cu)-silver (Ag) alloy electrical contact, comprising the steps of: (a) casting a first billet by melting a contact material including Ag and first metal; (b) forming a wire by extruding the first billet; (c) forming a chip by cutting the wire; (d) oxidizing the chip and then casting a second billet from an Ag alloy chip including first metal oxide by the oxidization; (e) forming a third billet by cutting and combining the second billet and a Cu or Cu alloy billet; (f) diffusion-bonding the third billet; and (g) forming a Cu-Ag alloy plate by extruding and rolling the third billet. According to the present invention, an Ag alloy layer functioning as a contact and a Cu layer are directly bonded to each other by diffusion bonding, thus forming a sound bonding interface and controlling formation of a Cu oxide layer that can be easily formed on the interface. Accordingly, the durability of an electrical contact may be increased.