发明名称 実装基板および光学装置
摘要 A mounting substrate includes: a wiring substrate; and a plurality of optical elements mounted on a mounting surface of the wiring substrate, and each having a first electrode and a second electrode. The wiring substrate includes a support substrate, a plurality of first wires, and a plurality of second wires. The first wires and the second wires are provided within a layer between the support substrate and the mounting surface. The first wires are electrically connected with the first electrodes. The second wires are electrically connected with the second electrodes, and each have cross-sectional area larger than cross-sectional area of each of the first wires.
申请公布号 JP5935557(B2) 申请公布日期 2016.06.15
申请号 JP20120153765 申请日期 2012.07.09
申请人 ソニー株式会社 发明人 渡辺 秋彦;大重 洋一;土居 正人;青柳 哲理
分类号 G09F9/30;G09F9/33;H01L27/14;H01L31/02;H01L33/36 主分类号 G09F9/30
代理机构 代理人
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