A semiconductor device includes: an inverter circuit configured to convert a DC voltage into an AC voltage by turning on and off four switching devices in a full bridge configuration; two conductive paths that are formed of electrical conductors connected to output ends of the inverter circuit; and a clamping circuit configured to turn two switching devices on, thereby being allowed to transmit electricity across the two conductive paths. The inverter circuit, the two conductive paths and the clamping circuit are housed in one package.
