发明名称 |
BIOFILM RESISTANT MEDICAL IMPLANT |
摘要 |
A method of incorporating silver and/or copper into a biomedical implant includes: providing an implant having an outer surface; depositing silver and/or copper onto the outer surface of the implant; diffusing the silver and/or copper into a subsurface zone adjacent the outer surface; and oxidizing or anodizing the implant after the diffusion step to form an oxidized or anodized layer that contains at least some amount of elemental silver, elemental copper or silver or copper ions or compounds. |
申请公布号 |
EP3024506(A1) |
申请公布日期 |
2016.06.01 |
申请号 |
EP20140830097 |
申请日期 |
2014.07.25 |
申请人 |
SMITH & NEPHEW, INC. |
发明人 |
PAWAR, VIVEK, D.;ROSE, JOHN;WEAVER, CAROLYN |
分类号 |
A61L27/30;A61L27/04;A61L27/50 |
主分类号 |
A61L27/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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