Semiconductor device

摘要

A semiconductor device has a semiconductor element provided with a functional surface on which a functional circuit is formed and with a back surface facing in the opposite direction to the functional surface, while also having a lead supporting the semiconductor element and electrically connected to the semiconductor element, and a resin package covering at least a portion of the semiconductor element and the lead. The semiconductor element has a functional surface side electrode formed on the functional surface and equipped with a functional surface side raised part that projects in the direction in which the functional surface faces. The functional surface side raised part of the functional surface side electrode is joined to the lead by solid state bonding.

主权项

1. A semiconductor device comprising:
a semiconductor element having a functional surface on which a functional circuit is formed and a back surface facing in an opposite direction to the functional surface; a conduction supporting member supporting the semiconductor element and electrically connected to the semiconductor element; and a resin package at least partially covering the semiconductor element and the conduction supporting member, wherein the semiconductor element includes a functional surface side electrode that is formed on the functional surface and equipped with a functional surface side raised part projecting in a direction in which the functional surface faces, the functional surface side raised part of the functional surface side electrode is joined to the conduction supporting member by solid state bonding, the functional surface side electrode has a base layer that contacts the functional surface, and the functional surface side electrode has a foundation layer laminated on the base layer.