发明名称 Pb-FREE Sb-In-BASED SOLDER ALLOY
摘要 PROBLEM TO BE SOLVED: To provide a Pb-free solder alloy for high temperature, which is excellent in bondability, workability and reliability and substantially inexpensive in comparison with Au-based solder.SOLUTION: A Pb-free Sb-In-based solder alloy for high temperature contains 18.0 mass% to 44.0 mass% of In and the balance Sb and inevitable impurities. The Sb-In-based solder alloy can contain further one or more kinds among Ag, Al, Cu, Mg, Sn, Ge, Zn, Ni and P in addition to the Sb and In as essential components.SELECTED DRAWING: None
申请公布号 JP2016097444(A) 申请公布日期 2016.05.30
申请号 JP20140239384 申请日期 2014.11.26
申请人 SUMITOMO METAL MINING CO LTD 发明人 IZEKI TAKASHI;KOMURO MASAHIKO;BONG SHUNKAI
分类号 B23K35/26;C22C12/00;H05K3/34 主分类号 B23K35/26
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