| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing a thermosetting resin composition capable of giving a cured product having enhanced adhesion between an inorganic filler and a thermosetting resin and having excellent heat resistance and excellent moisture resistance, to provide the thermosetting resin composition, and to provide an electronic component using the thermosetting resin composition.SOLUTION: The thermosetting resin composition is produced by a production method including a step of removing an organic substance from the surface of an inorganic filler to produce a clean surface, a step of depositing a chelate agent on the clean surface of the inorganic filler, a step of drying the inorganic filler on which the chelate agent is deposited to produce the inorganic filler covered with the chelate agent and a step of adding a thermosetting resin as a main agent and a curing agent to the inorganic filler covered with the chelate agent and mixing them.SELECTED DRAWING: None |
