| 摘要 |
The present invention provides a semiconductor device manufacturing apparatus and a semiconductor device manufacturing method which are capable of reducing incompleteness and damages of semiconductor chips when being peeled off from a rubber belt. A pickup apparatus (10) is provided with a semiconductor chip maintenance table (11) for maintaining the semiconductor chip to be stuck on the rubber belt, and a first groove (21a) and a second groove (22a) disposed on the side, where the semiconductor chips are maintained, of the maintenance table (11), wherein the first groove (21a) and the second groove (22a) are connected with at least two air vents (12), and the width (t2) of an opening portion of the second groove is smaller than the width (t1) of the opening portion of the first groove. The semiconductor chip is maintained on peak parts of the first and the second grooves in a manner that the side stuck with the rubber belt faces downwards, a pressure-reducing mechanism is used to reduce pressure in an enclosed space enclosed by the rubber belt, the first groove and the second groove, and then the pickup apparatus (10) picks up the semiconductor chip from the maintenance table by using a chunk. |
