发明名称 AN OVEN FOR ELECTRONIC COMPONENTS
摘要 An oven device for manufacturing an electronic component according to the present invention comprises: a chamber which maintains a constant inner temperature; a process subject supply means which supplies a process subject into the chamber; an ascending transfer means which includes a clamping means having holding support units for supporting the process subjects at multiple stages and an ascending transfer unit which sequentially moves the process subjects supported by the holding support units of the clamping means to an upper holding support unit; a descending transfer means which includes a clamping means having holding support units for supporting the process subjects at multiple stages and a descending transfer unit which sequentially moves the process subjects supported by the holding support units of the clamping means to a lower holding support unit; a transfer means which transfers the process subject between the ascending transfer means and the descending transfer means; and a process subject discharge means which discharges the process subject out of the chamber. According to the present invention, since an operator does not have to supply and recollect the process subject to and from a heating chamber manually, it is possible to prevent the oven device from being opened due to negligence of the operator during a manufacturing process.
申请公布号 KR20160056653(A) 申请公布日期 2016.05.20
申请号 KR20140157245 申请日期 2014.11.12
申请人 LEAD NEW TECHROLOGY. CO., LTD. 发明人 LEE, KWANG IL
分类号 H05K13/00 主分类号 H05K13/00
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