Wafer polishing tool using abrasive tape

摘要

An embodiment wafer polishing tool includes an abrasive tape, a polish head holding the abrasive tape, and a rotation module. The rotation module is configured to rotate a wafer during a wafer polishing process, and the polish head is configured to apply pressure to the abrasive tape toward a first surface of the wafer during the wafer polishing process.

主权项

1. A wafer polishing tool, comprising:
a polishing head configured to hold an abrasive tape; a rotation module configured to rotate a wafer during a wafer polishing process, wherein the polishing head is configured to rotate the abrasive tape around an axis and press the abrasive tape on a first region of a first surface of the wafer during the wafer polishing process, wherein the first region is smaller than the first surface, wherein the axis intersects the abrasive tape, and wherein the polishing head is configured to rotate the abrasive tape in a plane parallel to the first surface of the wafer during the wafer polishing process; and a bottom plate configured to provide support on a second region of a second surface of the wafer opposite the first surface during the wafer polishing process, wherein the first region of the first surface is directly opposite the second region of the second surface, wherein the bottom plate has a width smaller than a diameter of the wafer.